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Mechanical response of single-crystal copper under vibration excitation based on molecular dynamics simulation
【Abstract】 MD is used to study the mechanism of the effect of vibration on metallic materials. Applying vibration can improve the surface quality and reduce the tangential force. High-frequency vibration can promote dislocation motion. Design a vibration-assisted scratch experiment to verify the simulation results Since high-frequency vibration is usually used to assist metal processing in improving processing efficiency and quality. An in-depth understanding of the strengthening mechanism of high-frequency vibration-assisted metal processing is essential. In this paper, molecular dynamics (MD) simulation is performed for scratching under different vibration-assisted conditions, non-vibration-assisted, one-dimensional vibration-assisted, and two-dimensional vibration-assisted, to investigate the effect of high-frequency vibration on the scratching process of single-crystal copper at the atomic scale. Based on crystal defect analysis technology and dislocation theory, the influence mechanism of high-frequency vibration on the surface morphology, tangential force change, potential energy change, and dislocation defect structure evolution of single-crystal copper is studied. By analyzing the MD results, it is found that vibration-assisted scratching significantly improved the surface quality of single-crystal copper and reduced the tangential force of spherical diamond and that two-dimensional vibration-assisted scratching has the best effect. Vibration-assisted scratching experiments are also conducted to compare the experimental results with the molecular dynamics simulation results to verify the accuracy and credibility of the molecular dynamics simulation.
【Author】 ZhengQiu-yangab, ZhouZhen-yuab, DingCongab, LiYuab, LinEnab, YeSen-binab, PiaoZhong-yuab
【Keywords】 Vibration-assisted scratching, Molecular dynamics, Tangential force, Dislocation evolution
【Journal】 Journal of Manufacturing Processes(IF:3.5) Time:2022-01-25
【DOI】 10.1016/j.jmapro.2021.11.066 [Quote]
【Link】 Article PDF
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